基本信息
摘要：1,116,418. Component testing. MICRO TECH MFG. Inc. April 20, 1966 [April 21, 1965], No. 17231/66. Heading G1U. A device for successively testing a number of dice formed on a semi-conductor wafer comprises a means for moving the wafer beneath a test probe so that the probe successively tests each die (e.g. for open and short circuit) and a record card which is moved beneath a punch in synchronism with the movement of the wafer. Detection of a faulty element on the wafer results in the generation of a signal which actuates the punch to record a fault in a position on the record card corresponding to the position of the element on the wafer.
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