基本信息
摘要：PROBLEM TO BE SOLVED: To quickly perform failure countermeasures when performing inspection or failure analysis of a manufacturing process of a semiconductor wafer or a thin film substrate. SOLUTION: In this foreign matter or defect inspecting device inspecting by an optical system the size of the foreign matter or defect is associated with a failure cause in its result, the failure cause is designated by a data processing means from statistics of results of inspections, and result information of the inspections is displayed. Thresholds of failures per areas in the semiconductor wafer or the like are set and foreign matter is statistically evaluated for performing the failure analysis.
摘要附图：
