基本信息
摘要：A multi-layer printed or integrated circuit device having a multiplicity of layers 2 - 13 includes at least one signal layer 6 which embodies an electrical circuit and is disposed intermediate other layers of the device, and a multiplicity of exposed electrical terminal conductors 3 of which at least some extend through layers of the device to the signal layer. A sensing layer 8 which is conductive is disposed adjacent the signal layer, being electrically separated from the layer and any other conductive layer of the device. The sensing layer is capacitatively coupled to the signal layer and is electrically connected to a terminal 3a. The internal sensing layer takes the place of an external probe and facilitates testing of the device, particularly by a capacitative sensing method. The device and a semi conductor die 18 are mounted on a heat sink 17 and interconnected by bond wires 20.
摘要附图：
