基本信息
摘要：804,217. Thermoelectric devices. SIEMENS-SCHUCKERTWERKE A.G. Aug. 23, 1956 [Sept. 2, 1955], No. 25797/56. Class 37. [Also in Group XXII] In a process for producing a thermocouple, especially one used for the generation of cold, the thermoelectric elements are soldered in a non-oxidizing atmosphere under the action of ultrasonic vibrations, to provide low contact resistance between the elements, thus increasing the cold developed. The atmosphere, which is preferably flowing, may be carbon dioxide, nitrogen, helium, argon, or preferably a reducing atmosphere of, or containing, hydrogen. The process is particularly suitable when the thermoelectric elements are semi-conductors, especially of the extrinsic type, and is applicable to the production of a thermocouple in which a conductor, e.g. copper sheet, is soldered between the elements. Suitable solders are tin solders, indium alloys of low m.p., pure indium and pure bismuth.
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