基本信息
摘要：PURPOSE:To achieve that a block which is resistant to a shearing stress and which is composed of a glass and a semiconductor is bonded to a metal base by a method wherein the aria of the bonding part of a solder is made wide so as to be a shape which is resistant to the shearing stress and a metal thin film between the metal base stand and the glass or the semiconductor is exposed to the outside. CONSTITUTION:In a bonding method, a block which is composed of a glass or a semiconductor is bonded to a metal base stand by using a solder. In the bonding method, a cutout part is formed in a substrate which is composed of a glass or a semiconductor, a metal thin film is formed on the substrate, the cutout part is cut, the block 24 which is provided with the metal thin film 23 on the surface and the side face and which is composed of the glass or the semiconductor is formed, the metal thin film 23 on the block 24 is placed on the metal base stand 25, and a soldering operation is performed to be a fillet shape by using a solder 26.
摘要附图：
