基本信息
摘要：Support for sensor comprises a rigid palte (1) containing a recess (2), the bottom wall (2a) of which is thin and resiliently deformable under the action of the force to a thick-film resistor is bonded to the upper face (1b) of the support plate (1). Electrically conductors (C) connect the resistive element (R) to its electrical supply and processing circuits, fabricated by thick- or thin-film technology on adjacent parts of the upper face (1b). Absolute pressure may be measured by forming a closed and evacuated cavity (5) in the thickness of the plate.
摘要附图：
