基本信息
摘要：PURPOSE: A method for measuring thickness or a surface shape is provided to reduce the time for determining the thickness of the thin film layer by comparing simulation interferential signals corresponding to expected thickness with real interferential signals. CONSTITUTION: Simulation interferential signals are prepared on each thickness by simulation of interference signals on a sample thin film layer. A white light is emitted on the thin film layer. A real interferential signal is obtained(S120). Plural expected thicknesses are prepared from the real interferential signals(S139). The real interferential signal is compared with the simulation interferential signal(S140). The thickness of the simulation interferential signals which are in accord with the real interferential signals is determined as the thickness of the thin film layer(S150).
摘要附图：
